8486 | | | MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS OR FLAT PANEL DISPLAYS; MACHINES AND APPARATUS SPECIFIED IN NOTE 11(C) TO THIS CHAPTER; PARTS AND ACCESSORIES: | |
---|
8486.10 | | | - Machines and apparatus for the manufacture of boules or wafers: | |
---|
8486.10.10 |
10 |
.. | --- Machines and apparatus, as follows:
- for growing or pulling monocrystal semiconductor boules;
- machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);
- spin dryers for semiconductor wafer processing;
- sawing machines for sawing monocrystal semiconductor boules into slices;
- grinding, polishing or lapping machines;
- industrial or laboratory electric furnaces or ovens
| Free |
---|
8486.10.20 |
20 |
.. | --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | Free |
---|
8486.10.30 |
30 |
.. | --- Machines and apparatus, NSA, for the treatment of materials by a process involving a change of temperature | 5%
DCS:4%
DCT:5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.10.90 |
90 |
.. | --- Other | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.20 | | | - Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits | |
---|
8486.20.10 |
40 |
.. | --- Machines and apparatus, as follows:
- appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;
- physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;
- chemical vapour deposition apparatus;
- machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);
- epitaxial deposition machines;
- industrial or laboratory electric furnaces or ovens;
- spinners for coating photographic emulsions on semiconductor wafers;
- for dry-etching patterns on semiconductor materials;
- ij. ion implanters for doping semiconductor materials;
- apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;
- sawing machines for sawing wafers into chips;
- dicing machines for scribing or scoring semiconductor wafers
| Free |
---|
8486.20.20 |
57 |
.. | --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | Free |
---|
8486.20.30 |
59 |
No | --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8477 | 5%
DCS:4%
DCT:5% From 1 July 2018: 2.5% From 1 July 2019: Free |
---|
8486.20.40 |
60 |
No | --- Centrifuges, including centrifugal dryers | From 1 January 2017: 3.75% From 1 July 2017: 2.5% From 1 July 2018: 1.25% From 1 July 2019: Free |
---|
8486.20.90 |
61 |
.. | --- Other | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.30 | | | - Machines and apparatus for the manufacture of flat panel displays: | |
---|
8486.30.10 |
52 |
.. | --- Goods, as follows:
- apparatus for wet-etching, developing, stripping or cleaning of flat panel displays;
- apparatus and equipment for projection, drawing or plating circuit patterns, used for the manufacture of flat panel displays;
- machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);
- spinners for coating photographic emulsions
| Free |
---|
8486.30.20 |
78 |
.. | --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | Free |
---|
8486.30.30 |
80 |
No | --- Mechanical appliances for projecting, dispersing or spraying liquids, for use in the manufacture of flat panel displays, NSA | 5%
DCS:4%
DCT:5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.30.40 | 81 |
No | --- Centrifuges, including centrifugal dryers | 5%
DCS:4%
DCT:5% From 1 January 2017: 3.75% From 1 July 2017: 2.5% From 1 July 2018: 1.25% From 1 July 2019: Free |
---|
|
8486.30.90 |
54 |
.. | --- Other | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.40 | | | - Machines and apparatus specified in Note 11(C) to this Chapter: | |
---|
8486.40.10 |
54 |
.. | --- Machines and apparatus, as follows:
- machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);
- optical and other microscopes;
- drawing or marking-out instruments;
- die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;
- encapsulation equipment for the assembly of semiconductors;
- for bending, folding and straightening semiconductor leads;
- soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;
- industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;
- ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices
| Free |
---|
8486.40.20 |
20 |
.. | --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | Free |
---|
8486.40.3 |
|
| --- Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8477 or 8480.71.00: | |
---|
8486.40.31 |
55 |
.. | ---- Injection or compression moulds for rubber or plastics, other than goods of 8486.40.10 | 5% DCS:4% DCT:5% From 1 July 2019: Free |
---|
8486.40.39 |
56 |
.. | ---- Other | 5% DCS:4% DCT:5% From 1 July 2018: 2.5% From 1 July 2019: Free |
---|
8486.40.40 |
40 |
No | --- Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process | Free |
---|
8486.40.9 | | | --- Other, including machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays: | |
---|
8486.40.91 |
57 |
No | ---- Machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays | From 1 January 2017: 3.75% From 1 July 2017: 2.5% From 1 July 2018: 1.25% From 1 July 2019: Free |
---|
8486.40.99 |
58 |
No | ---- Other | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.90 | | | - Parts and accessories: | |
---|
8486.90.10 |
17 |
.. | --- Of goods of 8486.10.10, 8486.20.10, 8486.30.10 and 8486.40.10, other than goods of 8486.90.40 | Free
|
---|
8486.90.20 |
20 |
.. | --- Of goods of 8486.10.20, 8486.20.20, 8486.30.20 and 8486.40.20 | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.90.30 |
30 |
.. | --- Of goods of 8486.20.30 and 8486.40.3 | 5%
DCS:4%
DCT:5% From 1 July 2018: 2.5% From 1 July 2019: Free |
---|
8486.90.40 |
40 |
.. | --- Of soldering, brazing or welding machines of a kind described in 8515 | 5%
CA:Free From 1 July 2018: 2.5% CA:Free From 1 July 2019: Free |
---|
8486.90.50 |
50 |
No | --- Of machine-tools of a kind described in 8464, NSA | Free |
---|
8486.90.60 |
60 |
.. | --- Of goods of 8486.30.30 or 8486.40.40 | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|
8486.90.70 |
70 |
.. | --- Which, but for the operation of Note 11(D) to this Chapter, would be classified in 8466.10.00, 8466.20.00 or 8466.30.00 | Free |
---|
8486.90.9 |
| | --- Other: | |
---|
8486.90.91 |
90 |
.. | ---- Of goods of 8486.10.30 | From 1 January 2017: 3.75% From 1 July 2017: 2.5% From 1 July 2018: 1.25% From 1 July 2019: Free |
---|
8486.90.92 |
92 |
.. | ---- Of goods of 8486.20.40 or 8486.30.40 | 5% From 1 July 2018: 2.5% From 1 July 2019: Free |
---|
8486.90.93 |
93 |
.. | ---- Of goods of 8486.40.91 | From 1 January 2017: 3.75% From 1 July 2017: 2.5% From 1 July 2018: 1.25% From 1 July 2019: Free |
---|
8486.90.99 |
94 |
.. | ---- Other | 5% From 1 July 2018: 3.75% From 1 July 2019: Free |
---|